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Rochester Electronics LPC1827JET100E
Manufacturer # :LPC1827JET100E
Manufacturer :Rochester Electronics
Dasenic # :LPC1827JET100E-DS
Datasheet : LPC1827JET100E Datasheet
Customer # :
Description : IC MCU 32BIT 1MB FLASH 100TFBGA
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In Stock: 1510
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.574
Total :$ 10.57
Delivery :
Payment :
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LPC1827JET100E information
Rochester Electronics LPC1827JET100E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-TFBGA
- Supplier Device Package:100-TFBGA (9x9)
- Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, WDT
- Number of I/ O:49
- Speed:180MHz
- E E P R O M Size:16K x 8
- Core Processor:ARM® Cortex®-M3
- R A M Size:136K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
- Program Memory Size:1MB (1M x 8)
- Voltage - Supply ( Vcc/ Vdd):2.2V ~ 3.6V
- Data Converters:A/D 4x10b; D/A 1x10b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LPC1827JET100E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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