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Rochester Electronics LMH6646AMM/NOPB
Manufacturer # :LMH6646AMM/NOPB
Manufacturer :Rochester Electronics
Dasenic # :LMH6646AMM/NOPB-DS
Datasheet : LMH6646AMM/NOPB Datasheet
Customer # :
Description : IC OPAMP VFB 2 CIRCUIT 8VSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.341
Total :$ 1.34
Delivery :
Payment :
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LMH6646AMM/NOPB information
Rochester Electronics LMH6646AMM/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Current - Supply:725µA (x2 Channels)
- Output Type:Push-Pull, Rail-to-Rail
- Supplier Device Package:8-VSSOP
- Number of Circuits:2
- Amplifier Type:Voltage Feedback
- -3db Bandwidth:55 MHz
- Current - Output / Channel:20 mA
- Slew Rate:22V/µs
- Gain Bandwidth Product:-
- Current - Input Bias:650 nA
- Voltage - Input Offset:1 mV
- Voltage - Supply Span ( Min):2.5 V
- Voltage - Supply Span ( Max):12 V
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMH6646AMM/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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