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Rochester Electronics LMC6082IM-NS
Manufacturer # :LMC6082IM-NS
Manufacturer :Rochester Electronics
Dasenic # :LMC6082IM-NS-DS
Datasheet : LMC6082IM-NS Datasheet
Customer # :
Description : IC CMOS 2 CIRCUIT 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1787
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.3
Total :$ 8.30
Delivery :
Payment :
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LMC6082IM-NS information
Rochester Electronics LMC6082IM-NS technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Current - Supply:1.1mA (x2 Channels)
- Output Type:Push-Pull, Rail-to-Rail
- Supplier Device Package:8-SOIC
- Number of Circuits:2
- Amplifier Type:CMOS
- -3db Bandwidth:-
- Current - Output / Channel:34 mA
- Slew Rate:1.5V/µs
- Gain Bandwidth Product:1.3 MHz
- Current - Input Bias:0.01 pA
- Voltage - Input Offset:150 µV
- Voltage - Supply Span ( Min):4.5 V
- Voltage - Supply Span ( Max):15.5 V
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LMC6082IM-NS provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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