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Rochester Electronics LM63CIMA/NOPB

IC TEMP SENSR REMOTE DIODE 8SOIC
part number has RoHS
Manufacturer # :LM63CIMA/NOPB
Manufacturer :Rochester Electronics
Dasenic # :LM63CIMA/NOPB-DS
Customer # :
Description : IC TEMP SENSR REMOTE DIODE 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.5260$ 4.53
10+$ 3.9460$ 39.46
100+$ 3.3540$ 335.4
500+$ 3.2740$ 1637
In Stock: 1520
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.526
Total :$ 4.53
Delivery :
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LM63CIMA/NOPB information

  • Rochester Electronics LM63CIMA/NOPB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Thermal Management
  • Product Status:Active
  • Operating Temperature:0°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Output Type:2-Wire SMBus
  • Supplier Device Package:8-SOIC
  • Voltage - Supply:3V ~ 3.6V
  • Sensor Type:Internal and External
  • Topology:ADC (Sigma Delta), Comparator, Fan Speed Control, Register Bank
  • Accuracy:±3°C
  • Sensing Temperature:0°C ~ 125°C
  • Output Alarm:Yes
  • Output Fan:Yes
  • Function:Fan Control, Temp Monitor
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LM63CIMA/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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