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Rochester Electronics LM3S2016-IQC50-A2
Manufacturer # :LM3S2016-IQC50-A2
Manufacturer :Rochester Electronics
Dasenic # :LM3S2016-IQC50-A2-DS
Datasheet : LM3S2016-IQC50-A2 Datasheet
Customer # :
Description : IC MCU 32BIT 64KB FLASH 100LQFP
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In Stock: 11989
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.725
Total :$ 4.72
Delivery :
Payment :
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LM3S2016-IQC50-A2 information
Rochester Electronics LM3S2016-IQC50-A2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-LQFP
- Supplier Device Package:100-LQFP (14x14)
- Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/ O:40
- Speed:50MHz
- E E P R O M Size:-
- Core Processor:ARM® Cortex®-M3
- R A M Size:8K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:CANbus, I²C, IrDA, Microwire, SPI, SSI, UART/USART
- Program Memory Size:64KB (64K x 8)
- Voltage - Supply ( Vcc/ Vdd):2.25V ~ 2.75V
- Data Converters:A/D 4x10b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:3A991A2
- HTS US:8542.31.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LM3S2016-IQC50-A2 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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