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Rochester Electronics LM3876T/NOPB

IC AMP CLSS AB MONO 56W TO220-11
part number has RoHS
Manufacturer # :LM3876T/NOPB
Manufacturer :Rochester Electronics
Dasenic # :LM3876T/NOPB-DS
Customer # :
Description : IC AMP CLSS AB MONO 56W TO220-11
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
11+$ 4.4703$ 49.17
25+$ 3.6684$ 91.71
38+$ 3.5532$ 135.02
53+$ 3.4389$ 182.26
68+$ 3.3246$ 226.07
In Stock: 62
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.4703
Total :$ 4.47
Delivery :
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Payment :
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LM3876T/NOPB information

  • Rochester Electronics LM3876T/NOPB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Obsolete
  • Operating Temperature:-20°C ~ 85°C (TA)
  • Features:Mute, Short-Circuit and Thermal Protection
  • Mounting Type:Through Hole
  • Package / Case:TO-220-11 (Formed Leads)
  • Type:Class AB
  • Output Type:1-Channel (Mono)
  • Supplier Device Package:TO-220-11
  • Voltage - Supply:20V ~ 84V, ±10V ~ 42V
  • Max Output Power x Channels @ Load:56W x 1 @ 8Ohm
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LM3876T/NOPB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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