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Rochester Electronics LM324MX/J7001601
IC OPAMP GP 4 CIRCUIT 14SOP
Manufacturer # :LM324MX/J7001601
Manufacturer :Rochester Electronics
Dasenic # :LM324MX/J7001601-DS
Datasheet :
LM324MX/J7001601 Datasheet
LM324MX/J7001601 DatasheetCustomer # :
Description : IC OPAMP GP 4 CIRCUIT 14SOP
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| Quantity | Unit Price | Total |
In Stock: 1427
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
Payment :
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LM324MX/J7001601 information
Rochester Electronics LM324MX/J7001601 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Current - Supply:-
- Output Type:-
- Supplier Device Package:14-SOP
- Number of Circuits:4
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:40 mA
- Slew Rate:-
- Gain Bandwidth Product:-
- Current - Input Bias:90 nA
- Voltage - Input Offset:2 mV
- Voltage - Supply Span ( Min):3 V
- Voltage - Supply Span ( Max):32 V
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LM324MX/J7001601 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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