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Rochester Electronics LM3152MHE-3.3
Manufacturer # :LM3152MHE-3.3
Manufacturer :Rochester Electronics
Dasenic # :LM3152MHE-3.3-DS
Datasheet : LM3152MHE-3.3 Datasheet
Customer # :
Description : SWITCHING CONTROLLER, 500KHZ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 4416
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.718
Total :$ 2.72
Delivery :
Payment :
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LM3152MHE-3.3 information
Rochester Electronics LM3152MHE-3.3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - DC DC Switching Controllers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:14-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Output Type:Transistor Driver
- Supplier Device Package:14-HTSSOP
- Voltage - Supply ( Vcc/ Vdd):6V ~ 33V
- Frequency - Switching:500kHz
- Number of Outputs:1
- Topology:Buck
- Control Features:Enable, Soft Start
- Output Configuration:Positive
- Output Phases:1
- Duty Cycle ( Max):-
- Synchronous Rectifier:Yes
- Clock Sync:No
- Serial Interfaces:-
- Function:Step-Down
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LM3152MHE-3.3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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