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Rochester Electronics LM2904P3
IC OPAMP GP 2 CIRCUIT 8DIP
Manufacturer # :LM2904P3
Manufacturer :Rochester Electronics
Dasenic # :LM2904P3-DS
Datasheet :
LM2904P3 Datasheet
LM2904P3 DatasheetCustomer # :
Description : IC OPAMP GP 2 CIRCUIT 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 0.3600 | $ 3.6 |
| 2959+ | $ 0.2000 | $ 591.8 |
In Stock: 1506
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.36
Total :$ 0.36
Delivery :
Payment :
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LM2904P3 information
Rochester Electronics LM2904P3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Current - Supply:500µA (x2 Channels)
- Output Type:-
- Supplier Device Package:8-PDIP
- Number of Circuits:2
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:40 mA
- Slew Rate:0.3V/µs
- Gain Bandwidth Product:700 kHz
- Current - Input Bias:20 nA
- Voltage - Input Offset:3 mV
- Voltage - Supply Span ( Min):3 V
- Voltage - Supply Span ( Max):26 V
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LM2904P3 provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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