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1 : $48.1950
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Rochester Electronics LC5512B-10F256C
EE PLD, 12NS, 512-CELL PBGA256
Manufacturer # :LC5512B-10F256C
Manufacturer :Rochester Electronics
Dasenic # :LC5512B-10F256C-DS
Datasheet :
LC5512B-10F256C Datasheet
LC5512B-10F256C DatasheetCustomer # :
Description : EE PLD, 12NS, 512-CELL PBGA256
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 48.1950 | $ 48.2 |
| 25+ | $ 47.2320 | $ 1180.8 |
| 100+ | $ 45.2970 | $ 4529.7 |
| 500+ | $ 43.3710 | $ 21685.5 |
| 1000+ | $ 40.9590 | $ 40959 |
In Stock: 1555
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 48.195
Total :$ 48.20
Delivery :
Payment :
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LC5512B-10F256C information
Rochester Electronics LC5512B-10F256C technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Supplier Device Package:-
- Programmable Type:-
- Delay Time tpd(1) Max:-
- Voltage Supply - Internal:-
- Number of Logic Elements/ Blocks:-
- Number of Macrocells:-
- Number of I/ O:-
- Number of gates:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LC5512B-10F256C provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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