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Rochester Electronics LA1787M-MPB-E
SINGLE-CHIP TUNER IC
Manufacturer # :LA1787M-MPB-E
Manufacturer :Rochester Electronics
Dasenic # :LA1787M-MPB-E-DS
Datasheet :
LA1787M-MPB-E Datasheet
LA1787M-MPB-E DatasheetCustomer # :
Description : SINGLE-CHIP TUNER IC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.9980 | $ 2 |
| 25+ | $ 1.9620 | $ 49.05 |
| 100+ | $ 1.8810 | $ 188.1 |
| 500+ | $ 1.8000 | $ 900 |
| 1000+ | $ 1.7010 | $ 1701 |
In Stock: 32101
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.998
Total :$ 2.00
Delivery :
Payment :
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LA1787M-MPB-E information
Rochester Electronics LA1787M-MPB-E technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Receivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:64-BQFP
- Frequency:AM, FM
- Sensitivity:-
- Supplier Device Package:64-PQFP (14x14)
- Data Rate ( Max):-
- Memory Size:-
- Voltage - Supply:7.5V ~ 9V
- Data Interface:-
- Modulation or Protocol:AM, FM
- Current - Receiving:110mA
- Antenna Connector:PCB, Surface Mount
- Applications:Automotive
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LA1787M-MPB-E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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