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1 : $52.4970
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Rochester Electronics KU82304-25
MULTIFUNCTION PERIPHERAL PQFP132
Manufacturer # :KU82304-25
Manufacturer :Rochester Electronics
Dasenic # :KU82304-25-DS
Datasheet :
KU82304-25 Datasheet
KU82304-25 DatasheetCustomer # :
Description : MULTIFUNCTION PERIPHERAL PQFP132
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 52.4970 | $ 52.5 |
| 25+ | $ 51.4440 | $ 1286.1 |
| 100+ | $ 49.3470 | $ 4934.7 |
| 500+ | $ 47.2500 | $ 23625 |
| 1000+ | $ 44.6220 | $ 44622 |
In Stock: 5790
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 52.497
Total :$ 52.50
Delivery :
Payment :
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KU82304-25 information
Rochester Electronics KU82304-25 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microprocessors
- Product Status:Active
- Operating Temperature:-
- Package / Case:-
- Supplier Device Package:-
- Voltage - I/ O:-
- Speed:-
- Core Processor:-
- Number of Cores/ Bus Width:-
- Co- Processors/ D S P:-
- R A M Controllers:-
- Graphics Acceleration:-
- Display & Interface Controllers:-
- Ethernet:-
- S A T A:-
- U S B:-
- Security Features:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
KU82304-25 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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