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Rochester Electronics KM4270IM8TR3
Manufacturer # :KM4270IM8TR3
Manufacturer :Rochester Electronics
Dasenic # :KM4270IM8TR3-DS
Datasheet : KM4270IM8TR3 Datasheet
Customer # :
Description : IC VOLTAGE FEEDBACK 2 CIRC 8MSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 36016
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.429
Total :$ 0.43
Delivery :
Payment :
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KM4270IM8TR3 information
Rochester Electronics KM4270IM8TR3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Current - Supply:160µA (x2 Channels)
- Output Type:Rail-to-Rail
- Supplier Device Package:8-MSOP
- Number of Circuits:2
- Amplifier Type:Voltage Feedback
- -3db Bandwidth:4.3 MHz
- Current - Output / Channel:30 mA
- Slew Rate:9V/µs
- Gain Bandwidth Product:2 MHz
- Current - Input Bias:90 nA
- Voltage - Input Offset:1.5 mV
- Voltage - Supply Span ( Min):2.5 V
- Voltage - Supply Span ( Max):5.5 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
KM4270IM8TR3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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