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1 : $1.3770

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Rochester Electronics KESRX01G/IG/QP2Q

ZARLINK TELECOM CIRCUIT 1-FUNC
part number has RoHS
Manufacturer # :KESRX01G/IG/QP2Q
Manufacturer :Rochester Electronics
Dasenic # :KESRX01G/IG/QP2Q-DS
Customer # :
Description : ZARLINK TELECOM CIRCUIT 1-FUNC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.3770$ 1.38
25+$ 1.3500$ 33.75
100+$ 1.2960$ 129.6
500+$ 1.2420$ 621
1000+$ 1.1700$ 1170
In Stock: 28890
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.377
Total :$ 1.38
Delivery :
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Payment :
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KESRX01G/IG/QP2Q information

  • Rochester Electronics KESRX01G/IG/QP2Q technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Receivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:-
  • Frequency:434MHz
  • Sensitivity:-105dBm
  • Supplier Device Package:24-QSOP
  • Data Rate ( Max):50kbps
  • Memory Size:-
  • Voltage - Supply:5V
  • Data Interface:-
  • Modulation or Protocol:ASK
  • Current - Receiving:-
  • Antenna Connector:On-Board, Chip
  • Applications:RKE, Remote Control Systems
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
KESRX01G/IG/QP2Q provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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