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Rochester Electronics J105

JFET N-CH 25V 625MW TO92-3
part number has RoHS
Manufacturer # :J105
Manufacturer :Rochester Electronics
Dasenic # :J105-DS
Datasheet :pdf download J105 Datasheet
Customer # :
Description : JFET N-CH 25V 625MW TO92-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.5589$ 0.56
100+$ 0.5589$ 55.89
1000+$ 0.5589$ 558.9
In Stock: 1829
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5589
Total :$ 0.56
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J105 information

  • Rochester Electronics J105 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - JFETs
  • Product Status:Obsolete
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-226-3, TO-92-3 (TO-226AA)
  • Power - Max:625 mW
  • Supplier Device Package:TO-92-3
  • F E T Type:N-Channel
  • Drain to Source Voltage ( Vdss):-
  • Input Capacitance ( Ciss) ( Max) @ Vds:-
  • Voltage - Breakdown ( V( B R) G S S):25 V
  • Current - Drain ( Idss) @ Vds ( Vgs=0):500 mA @ 15 V
  • Current Drain ( Id) - Max:-
  • Voltage - Cutoff ( V G S off) @ Id:4.5 V @ 1 µA
  • Resistance - R D S( On):3 Ohms
  • US ECCN:EAR99
  • HTS US:8541.21.0095
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
J105 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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