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Rochester Electronics ISPLSI-3160-70LB272

EE PLD, 18NS, 160-CELL PBGA272
part number has RoHS
Manufacturer # :ISPLSI-3160-70LB272
Manufacturer :Rochester Electronics
Dasenic # :ISPLSI-3160-70LB272-DS
Customer # :
Description : EE PLD, 18NS, 160-CELL PBGA272
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 17.8470$ 17.85
25+$ 17.4870$ 437.18
100+$ 16.7760$ 1677.6
500+$ 16.0650$ 8032.5
1000+$ 15.1740$ 15174
In Stock: 3378
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.847
Total :$ 17.85
Delivery :
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Payment :
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ISPLSI-3160-70LB272 information

  • Rochester Electronics ISPLSI-3160-70LB272 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Programmable Type:-
  • Delay Time tpd(1) Max:-
  • Voltage Supply - Internal:-
  • Number of Logic Elements/ Blocks:-
  • Number of Macrocells:-
  • Number of I/ O:-
  • Number of gates:-
  • EU RoHS Status:Vendor omitted MSL Rating information
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ISPLSI-3160-70LB272 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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