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Rochester Electronics ISO7330FCQDWQ1
Manufacturer # :ISO7330FCQDWQ1
Manufacturer :Rochester Electronics
Dasenic # :ISO7330FCQDWQ1-DS
Datasheet : ISO7330FCQDWQ1 Datasheet
Customer # :
Description : DGTL ISO 3000VRMS 3CH 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1540
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.565
Total :$ 2.56
Delivery :
Payment :
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ISO7330FCQDWQ1 information
Rochester Electronics ISO7330FCQDWQ1 technical specifications, attributes, parameters.
- Category:Isolators/Digital Isolators
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Technology:Capacitive Coupling
- Type:General Purpose
- Number of Channels:3
- Supplier Device Package:16-SOIC
- Voltage - Supply:3V ~ 5.5V
- Data Rate:25Mbps
- Channel Type:Unidirectional
- Voltage - Isolation:3000Vrms
- Rise / Fall Time ( Typ):3ns, 2ns
- Isolated Power:No
- Inputs - Side 1/ Side 2:3/0
- Common Mode Transient Immunity ( Min):25kV/µs
- Propagation Delay tp L H / tp H L ( Max):58ns, 58ns
- Pulse Width Distortion ( Max):4ns
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ISO7330FCQDWQ1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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