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1 : $0.8778
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Rochester Electronics IRMCK099M
IC MOTOR DRIVER 3V-3.6V 32QFN
Manufacturer # :IRMCK099M
Manufacturer :Rochester Electronics
Dasenic # :IRMCK099M-DS
Datasheet :
IRMCK099M Datasheet
IRMCK099M DatasheetCustomer # :
Description : IC MOTOR DRIVER 3V-3.6V 32QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 5+ | $ 0.8778 | $ 4.39 |
In Stock: 16343
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.8778
Total :$ 0.88
Delivery :
Payment :
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IRMCK099M information
Rochester Electronics IRMCK099M technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Motor Drivers, Controllers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:32-WFQFN Exposed Pad
- Technology:Power MOSFET
- Interface:I²C, RS-232
- Supplier Device Package:32-QFN
- Voltage - Supply:3V ~ 3.6V
- Current - Output:-
- Output Configuration:Pre-Driver - Half Bridge (3)
- Voltage - Load:-
- Motor Type - Stepper:-
- Motor Type - A C, D C:AC, Synchronous
- Step Resolution:-
- Applications:Appliance
- Function:Controller - Commutation, Direction Management
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
IRMCK099M provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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