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Rochester Electronics IR21364SPBF

3-PHASE BRIDGE DRIVER
part number has RoHS
Manufacturer # :IR21364SPBF
Manufacturer :Rochester Electronics
Dasenic # :IR21364SPBF-DS
Customer # :
Description : 3-PHASE BRIDGE DRIVER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.5861$ 4.59
200+$ 1.7755$ 355.1
500+$ 1.7125$ 856.25
1000+$ 1.6825$ 1682.5
In Stock: 1342
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.5861
Total :$ 4.59
Delivery :
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Payment :
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  • Rochester Electronics IR21364SPBF technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Gate Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:28-SOIC (0.295", 7.50mm Width)
  • Input Type:Non-Inverting
  • Supplier Device Package:28-SOIC
  • Voltage - Supply:11.5V ~ 20V
  • Channel Type:3-Phase
  • Driven Configuration:Half-Bridge
  • Number of Drivers:6
  • Gate Type:IGBT, N-Channel MOSFET
  • Logic Voltage - V I L, V I H:0.8V, 2.5V
  • Current - Peak Output ( Source, Sink):200mA, 350mA
  • High Side Voltage - Max ( Bootstrap):600 V
  • Rise / Fall Time ( Typ):125ns, 50ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
IR21364SPBF provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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