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Rochester Electronics IDW60C65D1

POWER FIELD-EFFECT TRANSISTOR
part number has RoHS
Manufacturer # :IDW60C65D1
Manufacturer :Rochester Electronics
Dasenic # :IDW60C65D1-DS
Customer # :
Description : POWER FIELD-EFFECT TRANSISTOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
240+$ 1.3500$ 324
720+$ 1.2870$ 926.64
In Stock: 4320
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.35
Total :$ 1.35
Delivery :
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Payment :
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IDW60C65D1 information

  • Rochester Electronics IDW60C65D1 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
  • Product Status:Active
  • Mounting Type:Through Hole
  • Package / Case:TO-247-3
  • Supplier Device Package:PG-TO247-3
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Diode Type:Standard
  • Voltage - Forward ( Vf) ( Max) @ If:1.7 V @ 30 A
  • Current - Reverse Leakage @ Vr:40 µA @ 650 V
  • Diode Configuration:1 Pair Common Cathode
  • Voltage - D C Reverse ( Vr) ( Max):650 V
  • Current - Average Rectified ( Io) (per Diode):60A (DC)
  • Reverse Recovery Time (trr):66 ns
  • Operating Temperature - Junction:-40°C ~ 175°C
  • HTS US:0000.00.0000
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
IDW60C65D1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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