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1 : $34.6140
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Rochester Electronics ICM7170AIPG
REAL TIME CLOCK, CMOS, PDIP24
Manufacturer # :ICM7170AIPG
Manufacturer :Rochester Electronics
Dasenic # :ICM7170AIPG-DS
Datasheet :
ICM7170AIPG Datasheet
ICM7170AIPG DatasheetCustomer # :
Description : REAL TIME CLOCK, CMOS, PDIP24
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 34.6140 | $ 34.61 |
| 100+ | $ 25.9650 | $ 2596.5 |
| 1000+ | $ 22.5000 | $ 22500 |
In Stock: 12237
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 34.614
Total :$ 34.61
Delivery :
Payment :
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ICM7170AIPG information
Rochester Electronics ICM7170AIPG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Real Time Clocks
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Alarm
- Mounting Type:Through Hole
- Package / Case:24-DIP (0.600", 15.24mm)
- Type:Clock/Calendar
- Interface:-
- Supplier Device Package:24-PDIP
- Memory Size:-
- Voltage - Supply:1.9V, 2.6V ~ 5.5V
- Time Format:HH:MM:SS:hh (12/24 hr)
- Date Format:YY-MM-DD-dd
- Voltage - Supply, Battery:2.8V ~ 3.5V
- Current - Timekeeping ( Max):20µA @ 5V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ICM7170AIPG provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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