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  • Rochester Electronics ICL7611BCPA

    IC OPAMP GP 1 CIRCUIT 8DIP
  • part number has RoHS
  • Mfr.Part # :ICL7611BCPA
  • Manufacturer :Rochester Electronics
  • Dasenic # :ICL7611BCPA-DS
  • Datasheet :pdf download ICL7611BCPA Datasheet
  • Description : IC OPAMP GP 1 CIRCUIT 8DIP
  • Package :-
  • Quantity :
    Unit Price : $ 1.4963Total : $ 1.50
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 16909
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
226 +$ 1.4963$ 338.16
500 +$ 1.4400$ 720.00
1000 +$ 1.3613$ 1361.30

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Rochester Electronics ICL7611BCPA technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Amplifiers - Instrumentation, OP Amps, Buffer Amps
Product Status:Obsolete
Operating Temperature:0°C ~ 70°C
Mounting Type:Through Hole
Package / Case:8-DIP (0.300", 7.62mm)
Current - Supply:1mA
Output Type:-
Supplier Device Package:8-PDIP
Number of Circuits:1
Amplifier Type:General Purpose
-3db Bandwidth:-
Current - Output / Channel:-
Slew Rate:1.6V/µs
Gain Bandwidth Product:1.4 MHz
Current - Input Bias:1 pA
Voltage - Input Offset:5 mV
Voltage - Supply Span ( Min):2 V
Voltage - Supply Span ( Max):16 V
EU RoHS Status:RoHS non-compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Affected
US ECCN:EAR99
HTS US:8542.33.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
ICL7611BCPA provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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