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1 : $9.3420
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Rochester Electronics ICL7106CPL+3
IC DISPLAY DRIVR 3.5DIGIT 40DIP
Manufacturer # :ICL7106CPL+3
Manufacturer :Rochester Electronics
Dasenic # :ICL7106CPL+3-DS
Datasheet :
ICL7106CPL+3 Datasheet
ICL7106CPL+3 DatasheetCustomer # :
Description : IC DISPLAY DRIVR 3.5DIGIT 40DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 9.3420 | $ 9.34 |
| 25+ | $ 9.1530 | $ 228.83 |
| 100+ | $ 8.7840 | $ 878.4 |
| 500+ | $ 8.4060 | $ 4203 |
| 1000+ | $ 7.9380 | $ 7938 |
In Stock: 3240
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.342
Total :$ 9.34
Delivery :
Payment :
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ICL7106CPL+3 information
Rochester Electronics ICL7106CPL+3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Through Hole
- Package / Case:40-DIP (0.600", 15.24mm)
- Type:Display Driver
- Number of Channels:1
- Supplier Device Package:40-PDIP
- Voltage - Supply:9V
- Resolution ( Bits):3.5 Digit
- Sampling Rate ( Per Second):-
- Data Interface:-
- Voltage Supply Source:Single Supply
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ICL7106CPL+3 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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