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1 : $2.5800
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Rochester Electronics ICB2FL02GXUMA1
POWER SUPPLY SUPPORT CIRCUIT
Manufacturer # :ICB2FL02GXUMA1
Manufacturer :Rochester Electronics
Dasenic # :ICB2FL02GXUMA1-DS
Datasheet :
ICB2FL02GXUMA1 Datasheet
ICB2FL02GXUMA1 DatasheetCustomer # :
Description : POWER SUPPLY SUPPORT CIRCUIT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.5800 | $ 2.58 |
| 25+ | $ 2.5200 | $ 63 |
| 100+ | $ 2.4200 | $ 242 |
| 500+ | $ 2.3200 | $ 1160 |
| 1000+ | $ 2.2000 | $ 2200 |
In Stock: 1515
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.58
Total :$ 2.58
Delivery :
Payment :
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ICB2FL02GXUMA1 information
Rochester Electronics ICB2FL02GXUMA1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Lighting, Ballast Controllers
- Product Status:Active
- Operating Temperature:-25°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:18-SOIC (0.295", 7.50mm Width)
- Frequency:20kHz ~ 120kHz
- Current - Supply:4.2 mA
- Type:Ballast Controller
- Supplier Device Package:PG-DSO-18-2
- Voltage - Supply:17.5V
- Current - Output Source/ Sink:-
- Dimming:No
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ICB2FL02GXUMA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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