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Rochester Electronics HVC316TRU-E
VARIABLE CAPACITANCE DIODE
Manufacturer # :HVC316TRU-E
Manufacturer :Rochester Electronics
Dasenic # :HVC316TRU-E-DS
Datasheet :
HVC316TRU-E Datasheet
HVC316TRU-E DatasheetCustomer # :
Description : VARIABLE CAPACITANCE DIODE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.1280 | $ 0.13 |
| 25+ | $ 0.1255 | $ 3.14 |
| 100+ | $ 0.1203 | $ 12.03 |
| 500+ | $ 0.1152 | $ 57.6 |
| 1000+ | $ 0.1088 | $ 108.8 |
In Stock: 19200
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.128
Total :$ 0.13
Delivery :
Payment :
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HVC316TRU-E information
Rochester Electronics HVC316TRU-E technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Variable Capacitance (Varicaps, Varactors)
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:SC-79, SOD-523
- Supplier Device Package:2-UFP
- Diode Type:Single
- Voltage - Peak Reverse ( Max):30 V
- Capacitance @ Vr, F:0.76pF @ 25V, 1MHz
- Capacitance Ratio:9
- Capacitance Ratio Condition:C1/C25
- Q @ Vr, F:-
- EU RoHS Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8541.10.0070
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
HVC316TRU-E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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