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Rochester Electronics HSG1002VE-TL-E

RF 0.035A C BAND GERMANIUM NPN
part number has RoHS
Manufacturer # :HSG1002VE-TL-E
Manufacturer :Rochester Electronics
Dasenic # :HSG1002VE-TL-E-DS
Customer # :
Description : RF 0.035A C BAND GERMANIUM NPN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.3680$ 0.37
25+$ 0.3606$ 9.02
100+$ 0.3460$ 34.6
500+$ 0.3312$ 165.6
1000+$ 0.3128$ 312.8
In Stock: 43848
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.368
Total :$ 0.37
Delivery :
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Payment :
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HSG1002VE-TL-E information

  • Rochester Electronics HSG1002VE-TL-E technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - RF
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:4-SMD, Gull Wing
  • Power - Max:200mW
  • Supplier Device Package:4-MFPAK
  • Transistor Type:NPN
  • Current - Collector ( Ic) ( Max):35mA
  • Voltage - Collector Emitter Breakdown ( Max):3.5V
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:100 @ 5mA, 2V
  • Frequency - Transition:38GHz
  • Noise Figure (d B Typ @ f):0.7dB ~ 1.8dB @ 1.8GHz ~ 5.8GHz
  • Gain:8dB ~ 19.5dB
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
HSG1002VE-TL-E provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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