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Rochester Electronics HMC826LP6CETR

FRACTIONAL-N PLL WITH INTEGRATED
part number has RoHS
Manufacturer # :HMC826LP6CETR
Manufacturer :Rochester Electronics
Dasenic # :HMC826LP6CETR-DS
Customer # :
Description : FRACTIONAL-N PLL WITH INTEGRATED
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 12.3480$ 12.35
25+$ 12.1050$ 302.63
100+$ 11.6100$ 1161
500+$ 11.1150$ 5557.5
1000+$ 10.4940$ 10494
In Stock: 7500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.348
Total :$ 12.35
Delivery :
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HMC826LP6CETR information

  • Rochester Electronics HMC826LP6CETR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:40-VFQFN Exposed Pad
  • Type:-
  • Supplier Device Package:40-SMT (6x6)
  • Frequency - Max:1.1GHz
  • Number of Circuits:1
  • Output:Clock
  • Voltage - Supply:3V ~ 5.2V
  • P L L:Yes
  • Input:Clock
  • Ratio - Input: Output:1:1
  • Differential - Input: Output:No/Yes
  • Divider/ Multiplier:Yes/No
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
HMC826LP6CETR provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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