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  • Rochester Electronics HMC1169LP5E

    VCO 6.7475/13.495GHZ 2-13V 5X5MM
  • part number has RoHS
  • Mfr.Part # :HMC1169LP5E
  • Manufacturer :Rochester Electronics
  • Dasenic # :HMC1169LP5E-DS
  • Datasheet :pdf download HMC1169LP5E Datasheet
  • Description : VCO 6.7475/13.495GHZ 2-13V 5X5MM
  • Package :-
  • Quantity :
    Unit Price : $ 46.557Total : $ 46.56
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 1910
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 46.5570$ 46.56
10 +$ 37.1835$ 371.84
25 +$ 34.4628$ 861.57
100 +$ 31.1827$ 3118.27
250 +$ 29.4687$ 7367.18

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Rochester Electronics HMC1169LP5E technical specifications, attributes, parameters.
Category:Oscillators & Resonators/VCOs (Voltage Controlled Oscillators)
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Package / Case:32-VFQFN Exposed Pad, CSP
Size / Dimension:0.197" L x 0.197" W (5.00mm x 5.00mm)
Frequency Range:6.46 ~ 7.035GHz, 12.92 ~ 14.07GHz
Height:0.039" (1.00mm)
Voltage - Supply:5V
Frequency - Center:6.7475GHz, 13.495GHz
Tuning Voltage ( V D C):2 V ~ 13 V
2nd Harmonic, Typ (d Bc):22
Icc Max:260mA
Pushing ( M Hz/ V):2
Power (d Bm):3 ±4, 11 ±4
Phase Noise Typ (d Bc/ Hz):-86
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
HMC1169LP5E provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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