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Rochester Electronics HIP6018CB-T
Manufacturer # :HIP6018CB-T
Manufacturer :Rochester Electronics
Dasenic # :HIP6018CB-T-DS
Datasheet : HIP6018CB-T Datasheet
Customer # :
Description : PWM AND DUAL POWER CONTROL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.475
Total :$ 2.48
Delivery :
Payment :
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HIP6018CB-T information
Rochester Electronics HIP6018CB-T technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - Linear + Switching
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:24-SOIC (0.295", 7.50mm Width)
- Supplier Device Package:24-SOIC
- Voltage - Supply:10.8V ~ 13.2V
- Frequency - Switching:200kHz, 50kHz ~ 1MHz
- Number of Outputs:3
- Topology:Step-Down (Buck) Synchronous (1), Linear (LDO) (2)
- Voltage/ Current - Output 1:Adjustable, 1.8V ~ 3.5V
- Voltage/ Current - Output 2:Fixed, 2.5V
- Voltage/ Current - Output 3:Fixed, 1.5V
- w/ L E D Driver:No
- w/ Supervisor:No
- w/ Sequencer:Yes
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HIP6018CB-T provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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