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Rochester Electronics HIP0060AB

1.5AMP, 50V QUAD LOW SIDE POWER
part number has RoHS
Manufacturer # :HIP0060AB
Manufacturer :Rochester Electronics
Dasenic # :HIP0060AB-DS
Customer # :
Description : 1.5AMP, 50V QUAD LOW SIDE POWER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.0040$ 5
25+$ 4.9050$ 122.63
100+$ 4.7070$ 470.7
500+$ 4.5000$ 2250
1000+$ 4.2570$ 4257
In Stock: 3153
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.004
Total :$ 5.00
Delivery :
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Payment :
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HIP0060AB information

  • Rochester Electronics HIP0060AB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Gate Drivers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-SOIC (0.295", 7.50mm Width)
  • Input Type:Non-Inverting
  • Supplier Device Package:24-SOIC
  • Voltage - Supply:3.2V ~ 4.4V
  • Channel Type:Independent
  • Driven Configuration:Low-Side
  • Number of Drivers:4
  • Gate Type:N-Channel MOSFET
  • Logic Voltage - V I L, V I H:-
  • Current - Peak Output ( Source, Sink):-
  • High Side Voltage - Max ( Bootstrap):50 V
  • Rise / Fall Time ( Typ):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
HIP0060AB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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