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1 : $1.1880
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Rochester Electronics HIN237CP
RS-232 TRANSMITTER/RECEIVER
Manufacturer # :HIN237CP
Manufacturer :Rochester Electronics
Dasenic # :HIN237CP-DS
Datasheet :
HIN237CP Datasheet
HIN237CP DatasheetCustomer # :
Description : RS-232 TRANSMITTER/RECEIVER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.1880 | $ 1.19 |
| 25+ | $ 1.1610 | $ 29.03 |
| 100+ | $ 1.1160 | $ 111.6 |
| 500+ | $ 1.0710 | $ 535.5 |
| 1000+ | $ 1.0080 | $ 1008 |
In Stock: 3402
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.188
Total :$ 1.19
Delivery :
Payment :
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HIN237CP information
Rochester Electronics HIN237CP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:24-DIP (0.300", 7.62mm)
- Type:Transceiver
- Supplier Device Package:24-PDIP
- Voltage - Supply:4.5V ~ 5.5V
- Protocol:RS232
- Number of Drivers/ Receivers:5/3
- Duplex:Full
- Receiver Hysteresis:500 mV
- Data Rate:120Kbps
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HIN237CP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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