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Rochester Electronics HI3-DAC80V-7
12BIT, MONOLITHIC DAC
Manufacturer # :HI3-DAC80V-7
Manufacturer :Rochester Electronics
Dasenic # :HI3-DAC80V-7-DS
Datasheet :
HI3-DAC80V-7 Datasheet
HI3-DAC80V-7 DatasheetCustomer # :
Description : 12BIT, MONOLITHIC DAC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
In Stock: 1328
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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HI3-DAC80V-7 information
Rochester Electronics HI3-DAC80V-7 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
- Product Status:Active
- Operating Temperature:0°C ~ 75°C
- Mounting Type:Through Hole
- Package / Case:24-DIP (0.600", 15.24mm)
- Output Type:Voltage - Buffered
- Supplier Device Package:24-PDIP
- Data Interface:Parallel
- Number of Bits:12
- Voltage - Supply, Analog:±11.4V ~ 16.5V
- Voltage - Supply, Digital:±11.4V ~ 16.5V
- Architecture:R-2R
- Reference Type:External, Internal
- Number of D/ A Converters:1
- Settling Time:3µs (Typ)
- Differential Output:No
- I N L/ D N L ( L S B):±0.25, ±0.5
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HI3-DAC80V-7 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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