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  • Rochester Electronics HEC40106BT,112

    IC INVERT SCHMITT 6CH 1-INP 14SO
  • part number has RoHS
  • Mfr.Part # :HEC40106BT,112
  • Manufacturer :Rochester Electronics
  • Dasenic # :HEC40106BT,112-DS
  • Datasheet :pdf download HEC40106BT,112 Datasheet
  • Description : IC INVERT SCHMITT 6CH 1-INP 14SO
  • Package :-
  • Quantity :
    Unit Price : $ 0.1073Total : $ 0.11
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 8208
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.1073$ 0.11
25 +$ 0.1051$ 2.63
100 +$ 0.1008$ 10.08
500 +$ 0.0966$ 48.30
1000 +$ 0.0912$ 91.20

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Rochester Electronics HEC40106BT,112 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Gates and Inverters
Product Status:Active
Operating Temperature:-55°C ~ 125°C
Features:Schmitt Trigger
Mounting Type:Surface Mount
Package / Case:14-SOIC (0.154", 3.90mm Width)
Supplier Device Package:14-SO
Number of Circuits:6
Voltage - Supply:3V ~ 15V
Number of Inputs:1
Current - Quiescent ( Max):1 µA
Logic Type:Inverter
Current - Output High, Low:3.4mA, 3.4mA
Max Propagation Delay @ V, Max C L:60ns @ 15V, 50pF
Logic Level - Low:1.5V ~ 4V
Logic Level - High:3.5V ~ 11V
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
HEC40106BT,112 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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