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Rochester Electronics HCPL2730

Name: HCPL2730
Brand: Rochester Electronics
SKU: HCPL2730-DS
Price: 1.3050 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 5541

MOQ: 1

5 Price Tiers

Mfr.Part # :HCPL2730
Manufacturer :Rochester Electronics
Dasenic # :HCPL2730-DS
Datasheet : HCPL2730 Datasheet PDF
Description : LOGIC IC OUTPUT OPTOCOUPLER
Package :-
Unit Price: $1.3050
Total: $1.30

Quantity	Unit Price	You Save
1-1	$1.3050	-
2-25	$1.2780	2.1% save
26-100	$1.2240	6.2% save
101-500	$1.1790	9.7% save
501-1000	$1.1070	15.2% save

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Rochester Electronics HCPL2730 technical specifications, attributes, parameters.

Category:Isolators/Optoisolators - Transistor, Photovoltaic Output

Product Status:Obsolete

Operating Temperature:-40°C ~ 85°C

Mounting Type:Through Hole

Package / Case:8-DIP (0.300", 7.62mm)

Input Type:DC

Output Type:Darlington

Number of Channels:2

Supplier Device Package:8-DIP

Current - Output / Channel:60mA

Voltage - Isolation:2500Vrms

Rise / Fall Time ( Typ):-

Voltage - Output ( Max):7V

Voltage - Forward ( Vf) ( Typ):1.3V

Current - D C Forward ( If) ( Max):20 mA

Current Transfer Ratio ( Min):300% @ 1.6mA

Current Transfer Ratio ( Max):-

Turn On / Turn Off Time ( Typ):300ns, 5µs

Vce Saturation ( Max):-

EU RoHS Status:ROHS3 Compliant

MSL Rating:Vendor omitted MSL Rating information

REACH Status:REACH Unaffected

US ECCN:EAR99

HTS US:8541.49.8000

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

HCPL2730 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.