Name: HC9P-5509B-9
Brand: Rochester Electronics
SKU: DS-5729871
Price: 4.59 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Rochester Electronics HC9P-5509B-9

ITU CO/LOOP CARRIER SLIC

Manufacturer # :HC9P-5509B-9

Manufacturer :Rochester Electronics

Dasenic # :HC9P-5509B-9-DS

Datasheet :

HC9P-5509B-9 Datasheet

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Customer #

Description : ITU CO/LOOP CARRIER SLIC

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Quantity	Unit Price	Total
1+	$ 4.5900	$ 4.59
25+	$ 4.5000	$ 112.5
100+	$ 4.3110	$ 431.1
500+	$ 4.1310	$ 2065.5
1000+	$ 3.9060	$ 3906

In Stock: 3240

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 4.59

Total :$ 4.59

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HC9P-5509B-9 information

Rochester Electronics HC9P-5509B-9 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Interface - Telecom
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:28-SOIC (0.295", 7.50mm Width)
Current - Supply:-
Interface:2-Wire, 4-Wire
Supplier Device Package:28-SOIC
Number of Circuits:1
Power ( Watts):200 mW
Voltage - Supply:-42V ~ -58V, 4.75V ~ 5.25V
Function:Subscriber Line Interface Concept (SLIC)
EU RoHS Status:RoHS Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH is not affected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Rochester Electronics HC9P-5509B-9
Datasheet:
HC9P-5509B-9,

Rochester Electronics HC9P-5509B-9 Environmental and export classification status description
The Harris Semiconductor HC9P-5509B-9 is an integrated circuit (IC) that falls under the category of application-specific integrated circuits (ASICs). It is designed to provide specific and customized functions for various electronic applications. Functions: The HC9P-5509B-9 IC performs specific functions based on the application it is designed for. These functions can range from data processing, control logic, signal processing, interfacing with different peripherals, or any other custom functions required by the specific application. Applications: - Telecommunications equipment - Networking devices - Industrial automation systems - Medical devices - Embedded systems - Consumer electronics Alternative Components: - Texas Instruments ASICs - Intel FPGA chips - Xilinx programmable logic devices - Broadcom custom ICs Embedded Modules: The HC9P-5509B-9 IC can be integrated into various embedded modules and subsystems to provide specific functionalities within a larger electronic system. These embedded modules can include power management, communication interfaces, sensor interfacing, motor control, and more. Related Q&A: 1. What are the key advantages of using the Harris Semiconductor HC9P-5509B-9 IC in a telecommunications application? 2. How does the HC9P-5509B-9 IC compare to Xilinx FPGA chips in terms of flexibility and customization for industrial automation systems? 3. Can the HC9P-5509B-9 IC be programmed and reconfigured for different applications in consumer electronics devices? 4. What are the typical power requirements for the Harris Semiconductor HC9P-5509B-9 IC when integrated into a medical device? 5. Are there any specific qualifications or certifications required when using the HC9P-5509B-9 IC in safety-critical industrial applications?

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

HC9P-5509B-9 provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.