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1 : $7.5800
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Rochester Electronics HC5517CM
RINGING SLIC FOR ISDN MODEM
Manufacturer # :HC5517CM
Manufacturer :Rochester Electronics
Dasenic # :HC5517CM-DS
Datasheet :
HC5517CM Datasheet
HC5517CM DatasheetCustomer # :
Description : RINGING SLIC FOR ISDN MODEM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 7.5800 | $ 7.58 |
| 25+ | $ 7.4200 | $ 185.5 |
| 100+ | $ 7.1200 | $ 712 |
| 500+ | $ 6.8200 | $ 3410 |
| 1000+ | $ 6.4400 | $ 6440 |
In Stock: 1501
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.58
Total :$ 7.58
Delivery :
Payment :
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HC5517CM information
Rochester Electronics HC5517CM technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Obsolete
- Operating Temperature:0°C ~ 75°C
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Current - Supply:6mA
- Interface:2-Wire, 4-Wire
- Supplier Device Package:28-PLCC (11.51x11.51)
- Number of Circuits:1
- Power ( Watts):300 mW
- Voltage - Supply:4.75V ~ 5.25V
- Function:Subscriber Line Interface Concept (SLIC)
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
HC5517CM provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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