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Rochester Electronics HC55171IB

5 REN RINGING SLIC FOR ISDN
part number has RoHS
Manufacturer # :HC55171IB
Manufacturer :Rochester Electronics
Dasenic # :HC55171IB-DS
Customer # :
Description : 5 REN RINGING SLIC FOR ISDN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.9510$ 3.95
25+$ 3.8700$ 96.75
100+$ 3.7170$ 371.7
500+$ 3.5550$ 1777.5
1000+$ 3.3570$ 3357
In Stock: 1760
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.951
Total :$ 3.95
Delivery :
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Payment :
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HC55171IB information

  • Rochester Electronics HC55171IB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Telecom
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:28-SOIC (0.295", 7.50mm Width)
  • Current - Supply:6mA
  • Interface:2-Wire, 4-Wire
  • Supplier Device Package:28-SOIC
  • Number of Circuits:1
  • Power ( Watts):300 mW
  • Voltage - Supply:-16V ~ -80V, 4.75V ~ 5.25V
  • Function:Subscriber Line Interface Concept (SLIC)
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
HC55171IB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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