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1 : $3.8700
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Rochester Electronics HC55171CB
5 REN RINGING SLIC FOR ISDN
Manufacturer # :HC55171CB
Manufacturer :Rochester Electronics
Dasenic # :HC55171CB-DS
Datasheet :
HC55171CB Datasheet
HC55171CB DatasheetCustomer # :
Description : 5 REN RINGING SLIC FOR ISDN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.8700 | $ 3.87 |
| 25+ | $ 3.7890 | $ 94.73 |
| 100+ | $ 3.6360 | $ 363.6 |
| 500+ | $ 3.4830 | $ 1741.5 |
| 1000+ | $ 3.2940 | $ 3294 |
In Stock: 13037
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.87
Total :$ 3.87
Delivery :
Payment :
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HC55171CB information
Rochester Electronics HC55171CB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Active
- Operating Temperature:0°C ~ 75°C
- Mounting Type:Surface Mount
- Package / Case:28-SOIC (0.295", 7.50mm Width)
- Current - Supply:6mA
- Interface:2-Wire, 4-Wire
- Supplier Device Package:28-SOIC
- Number of Circuits:1
- Power ( Watts):300 mW
- Voltage - Supply:-16V ~ -80V, 4.75V ~ 5.25V
- Function:Subscriber Line Interface Concept (SLIC)
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HC55171CB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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