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1 : $30.3166
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Rochester Electronics HC5513BIM96
DLC/FLC SLIC W/LOW POWER STANDBY
Manufacturer # :HC5513BIM96
Manufacturer :Rochester Electronics
Dasenic # :HC5513BIM96-DS
Datasheet :
HC5513BIM96 Datasheet
HC5513BIM96 DatasheetCustomer # :
Description : DLC/FLC SLIC W/LOW POWER STANDBY
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 30.3166 | $ 30.32 |
| 25+ | $ 29.6512 | $ 741.28 |
| 100+ | $ 28.4681 | $ 2846.81 |
| 500+ | $ 27.2850 | $ 13642.5 |
| 1000+ | $ 25.7322 | $ 25732.2 |
In Stock: 4500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 30.3166
Total :$ 30.32
Delivery :
Payment :
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HC5513BIM96 information
Rochester Electronics HC5513BIM96 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Current - Supply:5.5mA
- Interface:2-Wire, 4-Wire
- Supplier Device Package:28-PLCC (11.51x11.51)
- Number of Circuits:1
- Power ( Watts):150 mW
- Voltage - Supply:±4.75V ~ 5.25V
- Function:Subscriber Line Interface Concept (SLIC)
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HC5513BIM96 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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