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1 : $7.9380
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Rochester Electronics HC4P5502A-5
EIA/ITU PABX SLIC
Manufacturer # :HC4P5502A-5
Manufacturer :Rochester Electronics
Dasenic # :HC4P5502A-5-DS
Datasheet :
HC4P5502A-5 Datasheet
HC4P5502A-5 DatasheetCustomer # :
Description : EIA/ITU PABX SLIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 7.9380 | $ 7.94 |
| 25+ | $ 7.7760 | $ 194.4 |
| 100+ | $ 7.4610 | $ 746.1 |
| 500+ | $ 7.1370 | $ 3568.5 |
| 1000+ | $ 6.7410 | $ 6741 |
In Stock: 6975
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.938
Total :$ 7.94
Delivery :
Payment :
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HC4P5502A-5 information
Rochester Electronics HC4P5502A-5 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Active
- Operating Temperature:0°C ~ 75°C
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Current - Supply:-
- Interface:2-Wire, 4-Wire
- Supplier Device Package:28-PLCC (11.51x11.51)
- Number of Circuits:1
- Power ( Watts):580 mW
- Voltage - Supply:-42V ~ -58V, 10.8V ~ 13.2V
- Function:Subscriber Line Interface Concept (SLIC)
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HC4P5502A-5 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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