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1 : $8.5050
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Rochester Electronics HC3-5504DLC-9
EIA/ITU PABX SLIC
Manufacturer # :HC3-5504DLC-9
Manufacturer :Rochester Electronics
Dasenic # :HC3-5504DLC-9-DS
Datasheet :
HC3-5504DLC-9 Datasheet
HC3-5504DLC-9 DatasheetCustomer # :
Description : EIA/ITU PABX SLIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 8.5050 | $ 8.51 |
| 25+ | $ 8.3340 | $ 208.35 |
| 100+ | $ 7.9920 | $ 799.2 |
| 500+ | $ 7.6590 | $ 3829.5 |
| 1000+ | $ 7.2270 | $ 7227 |
In Stock: 1790
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.505
Total :$ 8.51
Delivery :
Payment :
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HC3-5504DLC-9 information
Rochester Electronics HC3-5504DLC-9 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Through Hole
- Package / Case:24-DIP (0.300", 7.62mm)
- Current - Supply:-
- Interface:2-Wire, 4-Wire
- Supplier Device Package:24-PDIP
- Number of Circuits:1
- Power ( Watts):550 mW
- Voltage - Supply:-42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V
- Function:Subscriber Line Interface Concept (SLIC)
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HC3-5504DLC-9 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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