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1 : $7.7000
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Rochester Electronics HA4314BCB
XPOINT SWITCH, 4 CH, BIPOLAR
Manufacturer # :HA4314BCB
Manufacturer :Rochester Electronics
Dasenic # :HA4314BCB-DS
Datasheet :
HA4314BCB Datasheet
HA4314BCB DatasheetCustomer # :
Description : XPOINT SWITCH, 4 CH, BIPOLAR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 7.7000 | $ 7.7 |
| 100+ | $ 5.7600 | $ 576 |
| 1000+ | $ 5.0000 | $ 5000 |
In Stock: 1506
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.7
Total :$ 7.70
Delivery :
Payment :
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HA4314BCB information
Rochester Electronics HA4314BCB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches - Special Purpose
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Features:-
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Number of Channels:1
- Supplier Device Package:14-SOIC
- Multiplexer/ Demultiplexer Circuit:4:1
- Switch Circuit:-
- On- State Resistance ( Max):-
- Voltage - Supply, Single ( V+):-
- Voltage - Supply, Dual ( V±):±4.5V ~ 5.5V
- -3db Bandwidth:400MHz
- Applications:Video
- EU RoHS Status:RoHS non-compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
HA4314BCB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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