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Rochester Electronics GX1-233B-85-1.8

GX1 - 32-BIT MICROPROCESSOR
part number has RoHS
Manufacturer # :GX1-233B-85-1.8
Manufacturer :Rochester Electronics
Dasenic # :GX1-233B-85-1.8-DS
Customer # :
Description : GX1 - 32-BIT MICROPROCESSOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 38.0700$ 38.07
25+$ 37.3050$ 932.63
100+$ 35.7840$ 3578.4
500+$ 34.2630$ 17131.5
1000+$ 32.3550$ 32355
In Stock: 13362
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 38.07
Total :$ 38.07
Delivery :
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Payment :
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GX1-233B-85-1.8 information

  • Rochester Electronics GX1-233B-85-1.8 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microprocessors
  • Product Status:Active
  • Operating Temperature:0°C ~ 85°C (TC)
  • Package / Case:352-BGA Exposed Pad
  • Supplier Device Package:352-EBGA (35x35)
  • Voltage - I/ O:3.3V
  • Speed:233MHz
  • Core Processor:AMD Geode™ GX1
  • Number of Cores/ Bus Width:1 Core
  • Co- Processors/ D S P:-
  • R A M Controllers:-
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:LCD
  • Ethernet:-
  • S A T A:-
  • U S B:USB (2)
  • Security Features:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
GX1-233B-85-1.8 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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