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Rochester Electronics GVT71256E18T-9

STANDARD SRAM, 256KX18
part number has RoHS
Manufacturer # :GVT71256E18T-9
Manufacturer :Rochester Electronics
Dasenic # :GVT71256E18T-9-DS
Customer # :
Description : STANDARD SRAM, 256KX18
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.7400$ 3.74
25+$ 3.6600$ 91.5
100+$ 3.5000$ 350
500+$ 3.3600$ 1680
1000+$ 3.1800$ 3180
In Stock: 2517
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.74
Total :$ 3.74
Delivery :
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Payment :
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GVT71256E18T-9 information

  • Rochester Electronics GVT71256E18T-9 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:100-LQFP
  • Technology:SRAM - Standard
  • Supplier Device Package:100-TQFP (14x20)
  • Memory Size:4.5Mb (256K x 18)
  • Memory Type:Volatile
  • Voltage - Supply:3.135V ~ 3.6V
  • Clock Frequency:100 MHz
  • Access Time:8.5 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
GVT71256E18T-9 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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