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Rochester Electronics GTL1655DGG,512

IC TRNSLTR BIDIRECTIONAL 64TSSOP
part number has RoHS
Manufacturer # :GTL1655DGG,512
Manufacturer :Rochester Electronics
Dasenic # :GTL1655DGG,512-DS
Customer # :
Description : IC TRNSLTR BIDIRECTIONAL 64TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.1700$ 1.17
In Stock: 29472
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.17
Total :$ 1.17
Delivery :
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Payment :
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GTL1655DGG,512 information

  • Rochester Electronics GTL1655DGG,512 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Translators, Level Shifters
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:64-TFSOP (0.240", 6.10mm Width)
  • Output Type:Tri-State, Non-Inverted
  • Supplier Device Package:64-TSSOP
  • Number of Circuits:2
  • Data Rate:-
  • Input Signal:LVTTL
  • Output Signal:GTL
  • Translator Type:Mixed Signal
  • Channel Type:Bidirectional
  • Channels per Circuit:8
  • Voltage - V C C A:-
  • Voltage - V C C B:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:2 (1 Year,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
GTL1655DGG,512 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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