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1 : $129.3484
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Rochester Electronics FZ3600R12KE3NOSA1
IGBT MODULE
Manufacturer # :FZ3600R12KE3NOSA1
Manufacturer :Rochester Electronics
Dasenic # :FZ3600R12KE3NOSA1-DS
Datasheet :
FZ3600R12KE3NOSA1 Datasheet
FZ3600R12KE3NOSA1 DatasheetCustomer # :
Description : IGBT MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 129.3484 | $ 1293.48 |
| 500+ | $ 107.7903 | $ 53895.15 |
In Stock: 19420
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 129.3484
Total :$ 129.35
Delivery :
Payment :
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FZ3600R12KE3NOSA1 information
Rochester Electronics FZ3600R12KE3NOSA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Power - Max:-
- Supplier Device Package:-
- Configuration:-
- Input:-
- Current - Collector ( Ic) ( Max):-
- Voltage - Collector Emitter Breakdown ( Max):-
- Current - Collector Cutoff ( Max):-
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:-
- Input Capacitance ( Cies) @ Vce:-
- N T C Thermistor:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FZ3600R12KE3NOSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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