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Rochester Electronics FZ1800R17HP4B29BOSA2

IGBT MODULE 1700V 1800A
part number has RoHS
Manufacturer # :FZ1800R17HP4B29BOSA2
Manufacturer :Rochester Electronics
Dasenic # :FZ1800R17HP4B29BOSA2-DS
Customer # :
Description : IGBT MODULE 1700V 1800A
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1369.3500$ 1369.35
25+$ 1341.9630$ 33549.08
100+$ 1287.1890$ 128718.9
500+$ 1232.4150$ 616207.5
1000+$ 1163.9520$ 1163952
In Stock: 1674
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1369.35
Total :$ 1369.35
Delivery :
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FZ1800R17HP4B29BOSA2 information

  • Rochester Electronics FZ1800R17HP4B29BOSA2 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Power - Max:-
  • Supplier Device Package:-
  • Configuration:-
  • Input:-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • Current - Collector Cutoff ( Max):-
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:-
  • Input Capacitance ( Cies) @ Vce:-
  • N T C Thermistor:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FZ1800R17HP4B29BOSA2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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