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Rochester Electronics FZ1800R12KL4C

IGBT MODULE
part number has RoHS
Manufacturer # :FZ1800R12KL4C
Manufacturer :Rochester Electronics
Dasenic # :FZ1800R12KL4C-DS
Customer # :
Description : IGBT MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1170.4050$ 1170.41
25+$ 1146.9960$ 28674.9
100+$ 1100.1780$ 110017.8
500+$ 1053.3690$ 526684.5
1000+$ 994.8420$ 994842
In Stock: 1559
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1170.405
Total :$ 1170.40
Delivery :
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Payment :
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FZ1800R12KL4C information

  • Rochester Electronics FZ1800R12KL4C technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Power - Max:-
  • Supplier Device Package:-
  • Configuration:-
  • Input:-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • Current - Collector Cutoff ( Max):-
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:-
  • Input Capacitance ( Cies) @ Vce:-
  • N T C Thermistor:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8541.29.0095
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FZ1800R12KL4C provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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