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Rochester Electronics FSL106HR

IC OFFLINE SWITCH FLYBACK 8DIP
part number has RoHS
Manufacturer # :FSL106HR
Manufacturer :Rochester Electronics
Dasenic # :FSL106HR-DS
Customer # :
Description : IC OFFLINE SWITCH FLYBACK 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
200+$ 7.0800$ 1416
In Stock: 1464
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.08
Total :$ 7.08
Delivery :
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Payment :
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FSL106HR information

  • Rochester Electronics FSL106HR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - AC DC Converters, Offline Switchers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Supplier Device Package:8-DIP
  • Voltage - Breakdown:650V
  • Power ( Watts):13 W
  • Internal Switch(s):Yes
  • Voltage - Supply ( Vcc/ Vdd):8V ~ 26V
  • Frequency - Switching:100kHz
  • Output Isolation:Isolated
  • Topology:Flyback
  • Voltage - Start Up:12 V
  • Duty Cycle:77%
  • Fault Protection:Current Limiting, Over Load, Over Temperature, Over Voltage, Short Circuit
  • Control Features:-
  • HTS US:0000.00.0000
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FSL106HR provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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