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Rochester Electronics FS300R17KE4BOSA1
IGBT MOD 1700V 375A 1800W
Manufacturer # :FS300R17KE4BOSA1
Manufacturer :Rochester Electronics
Dasenic # :FS300R17KE4BOSA1-DS
Datasheet :
FS300R17KE4BOSA1 Datasheet
FS300R17KE4BOSA1 DatasheetCustomer # :
Description : IGBT MOD 1700V 375A 1800W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 4+ | $ 1173.3500 | $ 4693.4 |
In Stock: 591
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1173.35
Total :$ 1173.35
Delivery :
Payment :
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FS300R17KE4BOSA1 information
Rochester Electronics FS300R17KE4BOSA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
- Product Status:Not For New Designs
- Operating Temperature:-40°C ~ 150°C
- Mounting Type:Chassis Mount
- Package / Case:Module
- Power - Max:1800 W
- Supplier Device Package:Module
- Configuration:Three Phase Inverter
- Input:Standard
- Current - Collector ( Ic) ( Max):375 A
- Voltage - Collector Emitter Breakdown ( Max):1700 V
- Current - Collector Cutoff ( Max):3 mA
- I G B T Type:Trench Field Stop
- Vce(on) ( Max) @ Vge, Ic:2.3V @ 15V, 300A
- Input Capacitance ( Cies) @ Vce:24.5 nF @ 25 V
- N T C Thermistor:Yes
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FS300R17KE4BOSA1 provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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